| 摘要 |
<p>PURPOSE: A semiconductor package is provided to prevent the thickness of a semiconductor package from increasing due to the lamination of semiconductor chips by applying a step type window design. CONSTITUTION: A circuit pattern(111) is situated on one side of a first substrate(110). A window penetrated from one side of the first substrate and throughout another side, is formed. A circuit pattern(121) is located on one side of a second substrate(120). A window penetrated from one side of the second substrate and throughout another side, is formed. The second substrate comprises a step part which is exposed to the window of the first substrate. The step part comprises a die bonding area(122) and a wire bonding area.</p> |
