| 摘要 |
PURPOSE: Hot dipping mild and steel wires are provided to improve the strength of the plated layer and prevent the corrosion by controlling the micro-structure of the plated layer. CONSTITUTION: A hot dipping mild wire is plated with a molten plating solution, one of molten zinc, molten zinc-aluminum alloy and molten Zn-Al-Mg-Si alloy. The hot dipping mild wire contains one or more of Sc, Y, Zr, Hf, and Er to promote nucleation so that isotropic fine grains are formed uniformly.
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