摘要 |
Rectangular LED dice are mounted on a submount wafer. A first mold has rectangular indentations in it generally corresponding to the positions of the LED dice on the submount wafer. The indentations are filled with silicone, which when cured forms a clear first lens over each LED. Since the wafer is precisely aligned with the mold, the top surfaces of the first lenses are all within a single reference plane irrespective of any x, y, and z misalignments of the LEDs on the wafer. A second mold has rectangular indentations filled with a phosphor-infused silicone so as to form a precisely defined phosphor layer over the clear first lens, whose inner and outer surfaces are completely independent of any misalignments of the LEDs. A third mold forms an outer silicone lens. The resulting PC-LEDs have high chromaticity uniformity from PC-LED to PC LED within a submount wafer and from wafer to wafer, and high color uniformity over a wide viewing angle.
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