| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for loading a light emitting element, which has a plurality of light emitting elements and can obtain a high optical output in more conversion efficiency. <P>SOLUTION: The wiring board for loading the light emitting element for loading a plurality of light emitting diodes 30, 30..., in the interior of an insulating substrate includes a base substrate 10, and a reflector substrate 20 which laminates and adheres to its upper surface. In the base substrate, a non-through hole 11 is formed, a heat sink plate 12 of thick metal thin film is formed on its rear surface, and reflecting films 13 are formed on its inner periphery and bottom. Further, wiring patterns 14, 14..., are formed. On the other hand, in the reflector substrate 20, a through hole 21 larger than the diameter of the non-through hole of the base substrate is formed, and a reflecting film 22 is formed on its inner peripheral surface. This reflector substrate is arranged and adhered to the position exposed partly of the wiring pattern via the through hole. A plurality of the arranged light emitting diodes are connected to the wiring pattern on the base substrate and mounted. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
