发明名称 |
Methods for manufacturing miniature circuitry and inductive components |
摘要 |
A method for making plural plated through holes in a single circuit board via is provided. The method includes plating copper in the walls of said circuit board via to form a first plated through hole and applying a thin layer of first adhesive promotor to the surface of said plated via. The method further includes vacuum depositing an organic layer having a high dielectric strength unto said layer of first adhesive promoter and applying a second layer of adhesive promoter over said organic layer. The method even further includes plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.
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申请公布号 |
US7690110(B2) |
申请公布日期 |
2010.04.06 |
申请号 |
US20070895355 |
申请日期 |
2007.08.24 |
申请人 |
MULTI-FINELINE ELECTRONIX, INC. |
发明人 |
WHITTAKER RONALD W.;GUERRA JOE D;MARCOCI CIPRIAN |
分类号 |
H05K3/42 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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