| 摘要 |
PROBLEM TO BE SOLVED: To improve the throughput of a substrate bonding device. SOLUTION: The substrate bonding device which bonds a plurality of substrates one over another includes a pressing portion which pressing a plurality of substrate holders holding a plurality of substrates while heating them, and a temperature control portion which makes a thermal distribution of the substrate holders having been carried out of the pressing portion and released the held substrates uniform earlier than when they are left as they are. The temperature control portion may use a gaseous cooling medium. The substrate bonding device may further includes a cooling chamber for cooling the substrate holders holding the substrates. The cooling chamber may use a liquid cooling medium. COPYRIGHT: (C)2010,JPO&INPIT
|
