发明名称 |
ELECTRONIC PACKAGE, DISPLAY DEVICE AND ELECTRONIC APPARATUS |
摘要 |
<p>Provided is an electronic package wherein a built-in chassis (CS) and an FPC substrate (11) including a ground pattern (12) are mounted on a front bezel (BZ1) and a back bezel (BZ2) formed of a conductive material. A ground pattern (12) is arranged between the back bezel (BZ2) and the built-in chassis (CS), and the back bezel (BZ2) includes a claw section (22) for pressing the ground pattern (12) to the built-in chassis (CS). The claw section (22) has elasticity when the claw section is in a linear state, and presses the ground pattern (12) by a leading end (22T) formed by bending an outer periphery.</p> |
申请公布号 |
WO2010021200(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
WO2009JP61372 |
申请日期 |
2009.06.23 |
申请人 |
SHARP KABUSHIKI KAISHA;YOKONUMA SHINSUKE |
发明人 |
YOKONUMA SHINSUKE |
分类号 |
G09F9/00;G02F1/1333;H05K1/02;H05K7/14 |
主分类号 |
G09F9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|