| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer machining apparatus capable of correctly measuring the thickness of a wafer. Ž<P>SOLUTION: The semiconductor wafer machining apparatus includes: a pedestal 12 for placing a semiconductor wafer 11 as a workpiece at a substantially horizontal position; nozzles 26, 27 having supply ports 26a, 27a opposing to the machining surface of the semiconductor wafer respectively to supply a machining fluid 14 to the semiconductor wafer; and thickness measuring means 41a, 42a disposed in the inside of the nozzles and for emitting a sound wave or an electromagnetic wave to the machining surface of the semiconductor wafer via the supply ports to measure the thickness of the semiconductor wafer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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