| 摘要 |
<p>Wiring board bases (2-4) are provided with insulating substrates (1a-4a) having conductive layers (1b-4b) on the surfaces on one side, respectively; through holes (2e-4e) which are arranged on the insulating substrates and reach the conductive layers from the other surfaces; and conductive vias (2d-4d) connected to the conductive layers by filling the through holes with a conductive paste. In a method for manufacturing a laminated wiring board, at least one of the wiring board bases is laminated. Before the through hole is filled with the conductive paste, a surface portion in the through hole on the conductive layer is smoothed and a smooth surface section (2g) is formed.</p> |
