| 发明名称 |
RESIN STRUCTURE AND METHOD OF MANUFACTURING RESIN STRUCTURE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin structure which is manufactured at low cost through simple processes, and also to provide a method of manufacturing the resin structure in which the resin structure is manufactured at the low cost through the simple processes. <P>SOLUTION: Provided are the resin structure 100 including a holding resin layer 110 for holding at least one electronic component 130 and a resin layer support 120 disposed at least partially opposite the holding resin layer 110 and supporting the holding resin layer 110; and the method of manufacturing the resin structure 100. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| 申请公布号 |
JP2010010252(A) |
申请公布日期 |
2010.01.14 |
| 申请号 |
JP20080165485 |
申请日期 |
2008.06.25 |
| 申请人 |
KYORITSU KAGAKU SANGYO KK |
发明人 |
TSUBOUCHI MIKIHIKO;SHIINE TSUBASA;TANAKA HIROYUKI |
| 分类号 |
H01L23/29;H01L23/31 |
主分类号 |
H01L23/29 |
| 代理机构 |
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代理人 |
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