发明名称 |
WAFER FABRICATION MONITORING SYSTEMS AND METHODS, INCLUDING EDGE BEAD REMOVAL PROCESSING |
摘要 |
Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.
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申请公布号 |
WO2008103994(A3) |
申请公布日期 |
2009.12.30 |
申请号 |
WO2008US54913 |
申请日期 |
2008.02.25 |
申请人 |
RUDOLPH TECHNOLOGIES, INC.;CARLSON, ALAN;PAI, AJAY;LE, TUAN D.;PHILIP, ANTONY RAVI |
发明人 |
CARLSON, ALAN;PAI, AJAY;LE, TUAN D.;PHILIP, ANTONY RAVI |
分类号 |
H01L21/461;H01L21/66 |
主分类号 |
H01L21/461 |
代理机构 |
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