| 摘要 |
An ultrasonic sensor includes a resin substrate and an ultrasonic oscillator. The ultrasonic oscillator is provided approximately at the center of a component side of the resin substrate and generates and detects an ultrasonic wave. The resin substrate is made of, for example, a polycarbonate resin, i.e., the same material as a car bumper, and is shaped into a flat plate. The component side of the resin substrate is provided with a pad 11 adjacent to the ultrasonic oscillator. The pad is used for metal wiring based on wire bonding. The pad is made of a hard metal material excellent in conductivity and heat resistance such as stainless steel, and Al or Al alloy, for example. The resin substrate is formed as a single piece through insert molding by pouring a melted resin. Through this process, the pad is provided for the component side of the resin substrate. |
