| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist composition which has a wide process window in contact hole formation, and can suppress pit formation during flow baking, and to provide a pattern forming method using the same. <P>SOLUTION: The positive resist composition comprises: (A) a resin that increases the solubility to developer by the action of an acid and includes (a) a repeating unit containing a group that is decomposed by the action of an acid to become alkali-soluble, (b) a repeating unit containing an alicyclic lactone structure, (c) a repeating unit containing an alicyclic structure substituted with a hydroxy group and (d) a methacrylic acid repeating unit, wherein the amount of the methacrylic acid repeating unit is from 5 to 18% by mole based on the total repeating units of the resin; and (B) a compound that generates an acid upon exposure to active ray or radiant ray. The pattern forming method uses the composition. <P>COPYRIGHT: (C)2010,JPO&INPIT |
