SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor device is provided with a semiconductor element wherein a plurality of element electrodes are formed; a circuit board whereupon the semiconductor element is to be mounted and has substrate electrodes formed thereon corresponding to the element electrodes, respectively; and bumps, which connect the corresponding element electrodes and the substrate electrodes when the semiconductor element is mounted on the circuit board, and are arranged at least on the element electrodes or the substrate electrodes. A dielectric layer is arranged between at least one bump and the element electrode or the substrate electrode, and the element electrodes or the substrate electrodes, and the dielectric layer and the bumps configure a parallel plate capacitor.