METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

<P>PROBLEM TO BE SOLVED: To form a favorable line pattern when microfabricating width dimensions of a line and a space using a sidewall imprint technology. Ž<P>SOLUTION: A method of manufacturing a semiconductor device includes: a process which forms a sacrificial film 5 on a workpiece 4; a process which forms a resist film 6 in which a line and space pattern having a ratio of a line width and a space width on 1:1 basis has been patterned on the sacrificial film 5; a process which carries out the slimming of the resist film 6 and sets a line width dimension to one third of a space width dimension; a process which removes the resist film 6 after processing the sacrificial film 5 with the resist film 6 as a mask; a process which forms a sidewall film 9 on a sidewall of a line of a line and space pattern of the sacrificial film 5; a process which forms a frame-like protective pattern so as to surround a line pattern of the sidewall film 9 after removing the sacrificial film 5; and a process which processes the workpiece 4 with the line pattern and the protective pattern as masks. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž