发明名称 |
Printed circuit board and method of manufacturing the same |
摘要 |
The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a cylindrical shape, and thus exhibits good interlayer electrical connection and high reliability of physical contact upon thermal stress caused by the variance in physical properties of material depending on changes in temperature. The via has no upper land, and thus a fine circuit pattern of the circuit layer can be formed on the via.
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申请公布号 |
US2009260868(A1) |
申请公布日期 |
2009.10.22 |
申请号 |
US20080215413 |
申请日期 |
2008.06.27 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
OH CHANG GUN;HWANG MI SUN;LEE SUK WON |
分类号 |
H05K1/00;H05K3/42 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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