PURPOSE: A probe substrate manufacturing method is provided to improve the electrical characteristic by reducing the leak resistance. CONSTITUTION: A probe substrate manufacturing method is as follows. A ceramic sintered body(130) is prepared. The substrate comprises a substrate body and a probe part consisting of the conductive material. A protective layer(140) is formed to cover the side where a pad is formed on the ceramic sintered body. The probe part is bonded to the pad. The probe part(220) is exposed to outside by removing the substrate body. The ceramic sintered body includes the conductive via, an inner electrode and the pad(120) formed in an inside. The pad is formed on the upper or lower side. The pad is electrically connected to the conductive via and the inner electrode.
申请公布号
KR20090108983(A)
申请公布日期
2009.10.19
申请号
KR20080034359
申请日期
2008.04.14
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, YONG SUK;OH, YOUNG SOO;YOO, WON HEE;CHANG, BYEUNG GYU