发明名称 FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
摘要 <p>A film deposition apparatus which comprises: a treatment vessel having a space inside which serves as a vacuum space to which a film-depositing gas is supplied; a substrate-holding part which is disposed in the vacuum space and holds a substrate; a coil which inductively heats the substrate-holding part to thereby form a film from the film-depositing gas on the substrate and which has been divided into regions; and a coil control part which controls the coil region by region.</p>
申请公布号 EP2101345(A1) 申请公布日期 2009.09.16
申请号 EP20070832784 申请日期 2007.11.29
申请人 TOKYO ELECTRON LIMITED 发明人 MORISAKI, EISUKE;KOBAYASHI, HIROKATSU;YOSHIKAWA, JUN
分类号 H01L21/205;C23C16/46;H05B6/06;H05B6/10;H05B6/44 主分类号 H01L21/205
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