发明名称 CHIP FUSE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a chip fuse without freedom of pre-arcing characteristics restricted, preventing pre-arcing time at high magnification from getting short against the rated current, and for shortening a pre-arcing time at low magnification against the rated current. SOLUTION: The chip fuse 10 is so structured that a first heat storage layer 12 made of a film material with low thermal conductivity is formed on an insulation board 11, a fuse film 13 is formed on the first heat storage layer 12 so as not to come in contact with the insulation board 11. The fuse film 13 includes a fuse element part 13b between front electrode parts 13a arranged at either end of the fuse film, and a second heat storage layer 15 made of a film material with low thermal conductivity is formed on the fuse element part 13b, with the first heat storage layer 12 made thicker than the second heat storage layer 15. The first heat storage layer 12 and the second heat storage layer 15 are formed of a sheet-shaped material of a B-stage state containing a photosensitive group. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009193927(A) 申请公布日期 2009.08.27
申请号 JP20080036191 申请日期 2008.02.18
申请人 KAMAYA DENKI KK 发明人 YAMAGISHI KATSUYA;KIYONO HIDEKI;SATO HITOSHI
分类号 H01H85/045;H01H69/02;H01H85/046 主分类号 H01H85/045
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