| 摘要 |
PROBLEM TO BE SOLVED: To provide an easily utilizable curable resin composition dissolvable in an organic solvent, and to provide a cured product obtained by curing the curable resin composition, and having excellent heat resistance, chemical resistance and solvent resistance. SOLUTION: The compound has a plurality of aromatic rings or heterocyclic rings a part or the whole of which are bonded by a linking group having a ketal structure, and crosslinking groups bonded to the terminals of the structure, to impart solubility, or has a plurality of aromatic rings or heterocyclic rings bonded by a divalent linking group such as a single bond, an ether bond and a ketone bond, and acetylenes protected by ketone adducts or the like as crosslinking groups at the terminals. COPYRIGHT: (C)2009,JPO&INPIT
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