A semiconductor package using a coin ball is provided to increase the number of input and output terminals by narrowing the interval between coin balls. An upper package(100a) and a lower package(100b) are laminated. The upper package has a chip attaching area in the center of the upper surface. A conductive pattern(24) for bonding a wire is formed in a position adjacent to the chip attaching area. A ball land is formed in a lower boundary region to conduct with the conductive pattern for bonding the wire. One chip(12) or more are attached to the chip attaching area of the upper printed circuit board. A wire(14) is connected between bonding pads of the chip. The upper molding compound resin(16a) is molded in the upper surface of the upper printed circuit board.
