发明名称 Method of Double Patterning, Method of Processing a Plurality of Semiconductor Wafers and Semiconductor Device
摘要 A method of double patterning is disclosed. The method includes forming a first photosensitive layer; exposing the first photosensitive layer using a first reticle; developing the first photosensitive layer thereby forming a first image pattern including first elements; forming a second photosensitive layer; exposing the second photosensitive layer using the first reticle; and developing the second photosensitive layer thereby forming a second image pattern.
申请公布号 US2009194840(A1) 申请公布日期 2009.08.06
申请号 US20080024872 申请日期 2008.02.01
申请人 发明人 NOELSCHER CHRISTOPH;CHIU YI-MING;WU YUAN-HSUN
分类号 G03F7/30;G03F7/26;H01L21/30;H01L27/00 主分类号 G03F7/30
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