| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method for mounting components even when a tact is not lowered as much as a degree in the existing method, if a component is controlled in its pressing distance in accordance with height of a solder printed on a substrate. <P>SOLUTION: The apparatus includes a control means 30 for actualizing the steps that the predetermined region for measuring height of solder is divided into several regions, a plurality of typical points are determined within the divided regions, a solder height measuring means 12B measures solder height of the plurality of typical points, variation in the measured values is obtained, the predetermined region is repeatedly divided until variation obtained is settled to the allowable range if number of times of division is within the predetermined number of times, height of solder within the relevant region is set based on the measured value of the solder height for the plurality of typical points within the divided regions when the variation is set within the allowable range, and a component is mounted on the substrate by controlling pressing distance into the solder on the occasion of mounting the component on the substrate based on the preset solder height. <P>COPYRIGHT: (C)2009,JPO&INPIT |
