发明名称 Polishing method and polishing apparatus
摘要 A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.
申请公布号 US2009191791(A1) 申请公布日期 2009.07.30
申请号 US20090320471 申请日期 2009.01.27
申请人 EBARA CORPORATION 发明人 FUKUSHIMA MAKOTO;TOGAWA TETSUJI;YASUDA HOZUMI;NABEYA OSAMU;SAITO SHINGO
分类号 B24B1/00;B24B37/10;B24B37/30;B24B49/10;B24B57/02;H01L21/304 主分类号 B24B1/00
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