| 摘要 |
<p>In a passive radio frequency identification (RFID) transponder comprising an integrated circuit, an antenna coil, and at least one surface mount capacitor, a configuration is disclosed in which the surface mount capacitor is used as the integrated circuit carrier. The integrated circuit comprises a bumped die flip-chip, and the surface mount capacitor substrate has electrically conductive contacts and connections for electrically joining the antenna coil, capacitor, and integrated circuit. Transponders in accordance with embodiments of the invention do not include an intermediate substrate carrier onto which the capacitor and integrated circuit are mounted and interconnected, and to which the antenna coil is subsequently attached.</p> |
