发明名称 |
PROBE CARD, SEMICONDUCTOR INTEGRATED CIRCUIT TESTING DEVICE, AND SEMICONDUCTOR INTEGRATED CIRCUIT TEST METHOD |
摘要 |
PROBLEM TO BE SOLVED: To prevent a damage of a measuring probe needle when performing a large-numbered parallel test, and to heighten inspection efficiency, concerning a probe card, a semiconductor integrated circuit testing device and a semiconductor integrated circuit test method. SOLUTION: This probe card 1 equipped with a plurality of probe needle sets 3 corresponding respectively to a plurality of semiconductor integrated circuit chips 7 is provided with a mechanism 5 for switching a contact state/noncontact state to the semiconductor integrated circuit chip 7 relative to each probe needle set 3. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009150746(A) |
申请公布日期 |
2009.07.09 |
申请号 |
JP20070328218 |
申请日期 |
2007.12.20 |
申请人 |
FUJITSU MICROELECTRONICS LTD |
发明人 |
ENDO SEIJI |
分类号 |
G01R31/28;G01R1/073;G01R31/26;H01L21/66 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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