发明名称 PROBE CARD, SEMICONDUCTOR INTEGRATED CIRCUIT TESTING DEVICE, AND SEMICONDUCTOR INTEGRATED CIRCUIT TEST METHOD
摘要 PROBLEM TO BE SOLVED: To prevent a damage of a measuring probe needle when performing a large-numbered parallel test, and to heighten inspection efficiency, concerning a probe card, a semiconductor integrated circuit testing device and a semiconductor integrated circuit test method. SOLUTION: This probe card 1 equipped with a plurality of probe needle sets 3 corresponding respectively to a plurality of semiconductor integrated circuit chips 7 is provided with a mechanism 5 for switching a contact state/noncontact state to the semiconductor integrated circuit chip 7 relative to each probe needle set 3. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009150746(A) 申请公布日期 2009.07.09
申请号 JP20070328218 申请日期 2007.12.20
申请人 FUJITSU MICROELECTRONICS LTD 发明人 ENDO SEIJI
分类号 G01R31/28;G01R1/073;G01R31/26;H01L21/66 主分类号 G01R31/28
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