发明名称 |
Method of forming solder bump with reduced surface defects |
摘要 |
A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.
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申请公布号 |
US7553751(B2) |
申请公布日期 |
2009.06.30 |
申请号 |
US20060529377 |
申请日期 |
2006.09.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JEONG SE-YOUNG;CHOI JIN-HAK;KIM NAM-SEOG;LEE KANG-WOOK |
分类号 |
H01L21/44;H01L21/50;H01L21/60;H01L23/485 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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