| 摘要 |
An anti-peeling bonding pad and a forming method thereof are provided to prevent a peeling effect of a bonding pad by dispersing power applied to an insulating layer through a conductive pattern in a wire bonding process. An insulating layer is formed to cover a dummy pattern(24A). A conductive pattern(29) is formed on an upper surface of the insulating layer. A bonding process is performed. A binding pattern(28) is formed to bind the dummy pattern with the conductive pattern through the insulating layer. The binding pattern includes a hexagonal pattern or a pattern having a plurality of cylindrical or polygonal pillars arranged in a matrix. The dummy pattern includes a slit type pattern having a plurality of slits or the hexagonal pattern.
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