发明名称 Low melting point frit paste composition and sealing method for electric element using the same
摘要 The present invention relates to a low melting point frit paste composition and a sealing method for an electric element using the same, and more particularly, to a low melting point frit paste composition which is sealable and appropriate for a flat panel, protects an element weak to heat and improves a process yield with good print properties, and a sealing method for an electric element using the same.
申请公布号 US2009136766(A1) 申请公布日期 2009.05.28
申请号 US20080271252 申请日期 2008.11.14
申请人 DONGJIN SEMICHEM CO., LTD. 发明人 SON JUNG-HYUN;LEE SANG-KYU;JOO HAN-BOK
分类号 B05D3/06;B05D5/12;B32B17/06;C03C8/08 主分类号 B05D3/06
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