STRUCTURE WITH ELECTRONIC COMPONENT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH STRUCTURE

摘要

A structure with an electronic component mounted therein is provided with a wiring board having an electronic component mounted at least on a first surface; a resin arranged at least between the electronic component and the wiring board; and a plurality of holes arranged in a region which corresponds to an electronic component mounting position on the wiring board. The holes are filled with the resin to constitute the structure. Thus, warpage of the structure is suppressed, stress at a bonding section between the wiring board and the electronic component is modified, and reliability is improved.