Field-enhanced electrodes for additive-injection non-thermal plasma (NTP) processor

摘要

The present invention comprises a field enhanced electrode package for use in a non-thermal plasma processor. The field enhanced electrode package includes a high voltage electrode and a field-enhancing electrode with a dielectric material layer disposed in-between the high voltage electrode and the field-enhancing electrode. The field-enhancing electrode features at least one raised section that includes at least one injection hole that allows plasma discharge streamers to occur primarily within an injected additive gas.