| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bare chip mounting structure in which a lack in initial bonding strength of wire bonding hardly occurs and enough durability life can be ensured even if hot/cold temperature cycle is repeated. <P>SOLUTION: In the bare chip mounting structure J1, bare chips 14 and 15 made of semiconductor are mounted onto a resin case 23 via a silicone adhesive agent 50, and wire bonding is applied on a pad P exposed on the surface of the bare chips 14 and 15. In such the bare chip mounting structure J1, a vibration restriction mechanism L is provided on the resin case 23 to suppress the vibration of the bare chips 14 and 15. <P>COPYRIGHT: (C)2009,JPO&INPIT |
