| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metal based printed-circuit board with a heat discharge section that can efficiently dissipate heat generated by electronic components and the like through the heat dissipation fins of the heat discharge section by arranging the heat discharge section covering the whole part of the metal based printed-circuit board to enlarge the heat dissipation area, and to provide a manufacturing method for the same. <P>SOLUTION: A metal based printed-circuit board 1 has metal foil stuck on one surface 2a of a metal plate 2 with good thermal conductivity through an insulating adhesive layer. On the other surface 2b of the metal plate 2, a heat discharge section 5 composed of a plurality of dissipation fins 5b standing on end is arranged in a thin plate shape by digging down using a digging tool 6. After that, the board thickness of the bottom surface 2e formed between the adjoining dissipation fins 5b is formed with a smaller thickness than the board thickness of the bottom surface 2e of the metal plate 2. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
