APPRATUS FOR SAWING A WAFER HAVING A NOZZLE ELIMINATING A METAL BURR IN A SCRIBE LANE, METHOD OF SAWING THE WAFER AND SEMICONDUCTOR PACKAGE FABRICATED THEREBY THE SAME

摘要

An apparatus for sawing a wafer having a nozzle eliminating a metal burr in a scribe lane, method of sawing the wafer and semiconductor package fabricated thereby the same are provided to remove the metal protrusion and to prevent the short circuit of the wire bonding or the circuit board. The cutting blade(110) cuts the wafer(120) in order to partition the main chip(122) and moves to the predetermined progressive direction along the sawing lane in the scribe-lane(124) including the metal pad. The wafer sawing apparatus(100) comprises one or more protrusion removal nozzle(118) which has the predetermined angle of injection pattern in order to remove the protrusion of the metal pad passing through the cutting blade in the scribe-lane.