| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper electroplating method where, when copper electroplating is performed to the object to be plated such as a printed circuit board and a wafer with a structure filled with copper plating, so as to compose wiring such as a blind via hole, a trench and a hole for an interposer using a copper sulfate plating bath, organic matter produced upon continuous electroplating using a copper sulfate plating bath, which is considered to be produced in such a manner that an organic additive is oxidized or reduced can be efficiently oxidized and decomposed, the defect in the filling of copper plating, voids or the like caused by a decomposed/denatured organic product can be reduced as possible, and copper electroplating can be stably performed over a long period. SOLUTION: Metal copper is immersed into a copper sulfate plating bath comprising an organic additive with a bath current density of≤5A/L in such a manner that its immersion area is controlled to≥0.001 dm<SP>2</SP>/L per the volume of the plating bath, to the immersion area, 0.01L/dm<SP>2</SP>×min or above of air bubbling is applied, and copper electroplating is performed. COPYRIGHT: (C)2009,JPO&INPIT
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