| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring circuit board, along with its manufacturing method, capable of effectively preventing ion-migration of copper in a conductor pattern, and capable of effectively preventing discoloration of the conductor pattern. <P>SOLUTION: A conductor pattern 4 of copper is formed on a base insulating layer 3. A tin layer 9 is so formed as to cover the conductor pattern 4. The conductor pattern 4 and the tin layer 9 are heated at 300°C or higher so that the percentage of tin increases from an inside surface 11 adjoining the conductor pattern 4 toward an outside surface 12 not adjoining the conductor pattern 4. At the outside surface 12, a cover layer 5 in which the percentage of copper atom against tin is 3 or higher is formed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
