发明名称 |
ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE |
摘要 |
An electronic device (1) is provided with a wiring board (2) and a semiconductor chip (5). The wiring board (2) is provided with a first resin layer (3a) and a second resin layer (3b) stacked one over another by having a wiring (4) in between. The semiconductor chip (5) has bumps (6) on one side and is connected with the wiring (4) by entering into the first resin layer (3a) to bring the bumps (6) into contact with the wiring (4). The first resin layer (3a) includes a thermoplastic resin, and the second resin layer (3b) has an elasticity of 1 GPa or higher at a melting point of the first resin layer (3a).
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申请公布号 |
US2009020870(A1) |
申请公布日期 |
2009.01.22 |
申请号 |
US20060908460 |
申请日期 |
2006.03.14 |
申请人 |
WATANABE SHINJI;YAMAGUTI YUKIO |
发明人 |
WATANABE SHINJI;YAMAGUTI YUKIO |
分类号 |
H01L23/485;H01L21/60;H05K1/02 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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