发明名称 Laminate for flexible printed wiring board
摘要 To provide a laminate for a flexible printed wiring board excellent in signal response in the high frequency region. A laminate for a flexible printed wiring board having a three-layer laminated structure where a reinforcing layer (A), an electrical insulator layer (B) and an electrical conductor layer (C) are laminated in this order, wherein the electrical insulator layer (B) is made of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and the electrical conductor layer (C) has a surface roughness of at most 10 mum on the side being in contact with the electrical insulator layer (B). The laminate for a flexible printed wiring board is excellent in signal response in the high frequency region and excellent in flex resistance.
申请公布号 US7476434(B2) 申请公布日期 2009.01.13
申请号 US20070764405 申请日期 2007.06.18
申请人 ASAHI GLASS COMPANY, LIMITED 发明人 IWASA TSUYOSHI;FUNAKI ATSUSHI;HIGUCHI YOSHIAKI
分类号 B32B15/082;B32B15/20;B32B27/30 主分类号 B32B15/082
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