| 摘要 |
A thermo-electric cooling device includes at least one-layer resin substrate having electric connection regions existing with a predetermined pattern, thermo-electric semiconductor elements including a plurality of p-type thermo-electric semiconductor elements and n-type thermo-electric semiconductor elements arranged so as to correspond to the electric connection regions, and an electric circuit metal layer where the thermo-electric semiconductor elements are electrically connected in series via a junction layer in the electric connection regions. The electric connection regions are, for example, through holes, openings, or the like. The plurality of thermo-electric semiconductor elements are a plurality of pairs of p-type thermo-electric semiconductor elements and n-type thermo-electric conductive elements.
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