| 摘要 |
PURPOSE:To obtain a substrate having an excellent thermal conductivity by a method wherein a laminated material consisting of an Ag layer and active metal layers, or consisting of an Ag layer, active metal layers and a Cu layer is made to interpose in-between the AlN substrate and the Cu members. CONSTITUTION:An Ag metal, active metals (Ti, Zr, Hf and so forth) and an Cu metal are deposited on an AlN substrate 11, and a 0.5-10mum thickn laminated material is formed. The laminated material shall be a compositing of a 0.2-9mum thick Ag layer and a Ti layer and other active metal layers of a thickness of 0.1-5mum, or a composition consisting of a 2-9mum thick Ag layer, a Ti layer and other active metal layers of a thickness of 0.1-5mum and a less than 9mum thick Cu layer. Cu members 12 are superposed on the AlN substrate 11 and when the members 12 and the substrate 11 are cooled after being heated at 779-1,082 deg.C in a vacuum, the AlN substrate 11 and the Cu members 12 are firmly junctioned. As a result, a substrate having a superior insulating withstand voltage and heat radiating characteristics is obtained with no spewing of the melted liquid of alloys 13 from the junction parts of the AlN substrate 11 and the Cu members 12. |
