| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an Sn alloy thin film which has adequate solderability (low melting point) while preventing a whisker from forming, and has thin and uniform thickness. SOLUTION: The method for forming the thin film of the Sn-Ag-Cu ternary alloy on a substrate comprises immersing the substrate into a plating bath and electroplating it to form the thin film of the Sn-Ag-Cu ternary alloy on the whole area or a part of the substrate. The plating bath includes at least an Sn compound, an Ag compound, a Cu compound, an inorganic chelating agent and an organic chelating agent. The inorganic chelating agent is blended at a ratio of 1 to 300 pts. by mass with respect to the Ag compound of 1 pt. by mass, and the organic chelating agent is blended at a ratio of 1 to 200 pts. by mass with respect to the Cu compound of 1 pt. by mass. COPYRIGHT: (C)2006,JPO&NCIPI
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