| 摘要 |
<p>The invention relates to a liquid cooling device for a computer, provided for a housing (1), enclosing a computer processor. In order to dissipate the heat by a radiant effect, the device advantageously comprises heat-removal means (20, 22, 23, 25) within the housing, attached to a lower wall (100), an upper wall (105) and at least one lateral wall (102, 103) of the housing (1). Each of the heat-removal means has two walls (P1, P2) at a separation from each other, made from a thermally-conducting material between which at least one circulation channel for a fluid is formed which is connected by a closed circuit (3) to at least one cooling element (61, 62, 63, 64, 65), attached to a power component in the computer. A pump (30), integrated in the circuit (3), circulates the fluid which permits a dissipation of the heat across the walls.</p> |
