| 摘要 |
PROBLEM TO BE SOLVED: To prevent the quality of both a substrate 1 and an electronic component 10 from deteriorating due to thermal deterioration by shortening the machining time required for soldering even in case of a printed board being produced by using solder of high melting point such as lead-free solder. SOLUTION: In a printed board A where the lead wire 11 of an electronic component 10 is inserted into a through hole 3 and secured through solder 20 to a substrate 1 having the through hole 3 penetrating in the thickness direction, a portion (cut) 12 having a reduced cross-sectional area is formed in the lead wire 11 thus reducing apparent thermal capacity of the lower region 13. Consequently, temperature at the soldering portion rises quickly and required soldering can be ended in a short time. COPYRIGHT: (C)2006,JPO&NCIPI
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