| 摘要 |
PROBLEM TO BE SOLVED: To increase manufacture quality by suppressing the occurrence of warpage by contraction in baking when manufacturing a capacitor structure having a metal layer and a dielectric layer. SOLUTION: A non-sintered dielectric sheet 2 applied onto a PET film 6, nickel foil 1, and a non-sintered alumina sheet 3 applied onto a PET film 7 are prepared each, and are laminated for thermocompression bonding so that both the surfaces of the nickel foil 1 come into contact with the non-sintered dielectric sheet 2 and the non-sintered alumina sheet 3, respectively. After that, the PET films 6, 7 are separated for obtaining a BT/alumina three-layer laminate 4 before baking. When the laminate 4 is baked, a BT/alumina three-layer laminate 14 is formed. In baking, although the non-sintered dielectric sheet 2 is baked and contracted, the non-sintered alumina sheet 3 is similarly baked and contracted, thus canceling stress by both the baking and contraction, and hence preventing the warpage from occurring in the nickel foil 1. COPYRIGHT: (C)2006,JPO&NCIPI
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