| 摘要 |
<p>The particle diameter distribution of the filler material added to the adhesive of the invention has the first peak and the second peak positioned on a side of smaller particle diameters with respect to the first peak by 0.7mu or more, and thus the rigidity of the hardened adhesive is improved. Therefore, the connection reliability of the electric device 5 having the semiconductor chip 11 and the substrate 13 by using the adhesive (adhesive film 15 ) is improved.</p> |
