THERMAL MANAGEMENT DEVICE FOR A MEMORY MODULE

摘要

A memory module (100) which includes a memory board (110) having two major surfaces, one of the major surfaces with a plurality of chips (112) thereon, wherein at least one of the chips operates at a higher power than at least one other of the chips; and a thermal management system (10) in thermal contact with one or more of the chips (114) which operate at a higher power than at least one other of the chips (112), wherein the thermal management system (10) spreads heat generated by the one or more of the chips (114) which operate at a higher power than at least one other of the chips (112) with which the thermal management system (10) is in contact.