| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor device capable of suppressing an influence of disturbance such as electric noise or temperature, and heightening accuracy. <P>SOLUTION: This device is equipped with a sensor chip 1 having a sensor part Ds equipped with a movable part formed by using an SOI wafer (first semiconductor substrate) and constituted of an overlapping part 12 and each bending part 13; the first package substrate 2 having a through hole wire 24 formed by using a silicon wafer (second semiconductor substrate) and connected electrically to the sensor part Ds, wherein the sensor chip 1 is mounted on one surface side; and the second package substrate 3 formed by using another silicon wafer (third semiconductor substrate) and sealed in the enclosing form of the sensor chip 1 on one surface side of the first package substrate 2. A circuit part Dc for performing signal processing of an output signal from the sensor part Ds is formed on the sensor chip 1. The circuit part Dc includes a temperature detection part and a temperature compensation circuit. <P>COPYRIGHT: (C)2008,JPO&INPIT |
