| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board easily conducting an alignment and being capable of surely preventing the generation of a defective connection when mounting an electronic part to the wiring board and a manufacturing method for the wiring board. SOLUTION: The wiring board has gold bumps 4 formed in the electronic part 3, through-holes 5 fitting the gold bumps 4 formed in the wiring board 2 with a wiring pattern and metal plating layers 6 being formed by a coating on the internal side faces of the through-holes 5 while connecting the gold bumps 4 and the wiring pattern. The through-holes 5 have opening sections 7a with larger diameters towards the outside. The wiring board with an active element, a passive element or the wiring pattern is used as the electronic part 3. The gold bumps 4 are formed in the electronic part 3. The through-holes 5 are formed in the wiring board 2 with the wiring pattern. The metal plating layers 6 coating the internal side faces of the through-holes 5 are formed, and the metal plating layers 6 and the wiring pattern are connected. The electronic part 3 is superposed and pushed against the wiring board 2, the gold bumps 4 are fitted into the through-hole 5 and the electronic part 3 is connected to the wiring pattern. COPYRIGHT: (C)2009,JPO&INPIT |
