| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting system and an electronic component mounting method capable of efficiently correcting a mount position according to a solder print position in a component mounting mode of holding a plurality of discrete substrates on a carrier. <P>SOLUTION: In mounting electronic components for the plurality of discrete substrates held by the carrier, solder position deviation data is calculated for each discrete substrate, based on a mark position recognition result for carriers after solder print, a solder position recognition result, and electrode position information indicating the position of an electrode in the discrete substrate. Position deviation is corrected based on the calculated solder position deviation data, and position correction data for mounting electronic components at an appropriate position is computed for each discrete substrate and are feed-forwarded to an electronic component mount apparatus. The mount operation of electronic components by a component mount mechanism is controlled by considering the position correction data and the mark position recognition result. <P>COPYRIGHT: (C)2009,JPO&INPIT |
