| 发明名称 |
METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING |
| 摘要 |
Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues. |
| 申请公布号 |
EP1997138(A2) |
申请公布日期 |
2008.12.03 |
| 申请号 |
EP20070753639 |
申请日期 |
2007.03.21 |
| 申请人 |
PROMERUS LLC |
发明人 |
APANIUS, CHRIS;SHICK, ROBERT, A.;NG, HENDRA;BELL, ANDREW;ZHANG, WEI;NEAL, PHIL |
| 分类号 |
H01L21/98;H01L25/065 |
主分类号 |
H01L21/98 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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